Hauj lwm lawm
Xa kev nug
Technical Specifications
|
Specification |
Tus nqi |
|
Hom |
Bluetooth Tsawg Zog Module |
|
Bluetooth Version |
5.3 |
|
Core |
ARM Cortex-M33, 32-ntsis |
|
Cov ntaub ntawv tus nqi |
2 Mbps ib |
|
Hloov Hwj chim |
+10 dBm |
|
Tus txais rhiab heev |
-97 dBm |
|
Kev khiav hauj lwm voltage |
1.8 – 3.6 V |
|
Pw tsaug zog tam sim no |
1.3 µA |
|
Peak Current (Tx) |
5.0 mA @ 0 dBm |
|
Peak tam sim no (Rx) |
4.4 mA @ 1 Mbps |
|
Flash Nco |
1024 Kb |
|
RAM |
128 Kb |
|
Interfaces |
UART / I2C / SPI |
|
Qhov ntev |
15 × 20 × 2 mm |
|
Ua raws |
RoHS / REACH |
Daim ntawv thov teb
- Ntse tsev automation - teeb pom kev zoo, HVAC, tswb, thiab tswj kev nkag.
- Consumer electronics – wireless peripherals, wearables, thiab mobile device connectivity.
- Industrial IoT - sensor networks, tshuab telemetry, thiab kev saib xyuas kev kwv yees.
- Cov cuab yeej kho mob - wireless saib xyuas thiab kho mob sensors.
- Bluetooth Mesh networking - scalable IoT thiab automation systems.
Lub module siv hluav taws xob tsawg thiab compact SMT tsim ua rau nws zoo tagnrho rau embedded daim ntaub ntawv xav tau lub zog efficiency thiab txhim khu kev qha wireless kev sib txuas lus.
PCBA Integration Advantages
- SMT Compatibility: Txheem SMT pob txhawb nqa automated xaiv-thiab-qhov chaw thiab tsis muaj hlau lead-dawb reflow soldering.
- Compact Footprint: 15 × 20 mm loj tso cai yooj yim kev koom ua ke rau hauv kev txwv PCB layouts.
- Hwj chim Efficiency: Ultra-tsawg pw tsaug zog tam sim no ua kom lub neej ntev roj teeb hauv IoT li.
- RF Layout Optimization: Txhim kho impedance-matched kav hlau txais xov kab thiab khaws cia huv RF thaj tsam kom ua tau zoo.
- Peripheral Integration: Ua-nyob rau hauv UART / I2C / SPI interfaces ua kom yooj yim PCB routing thiab txo cov khoom siv sab nraud.
- Npaj ntau lawm: Ua tiav nrog SMT / PCBA cov txheej txheem, ua raws li RoHS / REACH cov qauv.
Cim npe nrov: hm-bt4531-st, Tuam Tshoj hm-bt4531-st manufacturers, lwm tus, Hoobkas
