Copper foil substrate yog thawj zaug txiav rau hauv qhov ntau thiab tsawg haum rau kev ua thiab ntau lawm. Ua ntej lamination, cov ntawv ci tooj liab ntawm qhov chaw substrate feem ntau yog roughened siv txoj kev xws li txhuam thiab micro-etching. Qhuav zaj duab xis photoresist yog ces adhered rau lub substrate siv qhov tsim nyog kub thiab quab yuam. Lub substrate nrog cov zaj duab xis qhuav photoresist yog tom qab ntawd muab tso rau hauv lub tshuab hluav taws xob UV kom raug. Lub teeb UV nyob rau hauv cov pob tshab ntawm cov yeeb yaj kiab ua rau muaj cov tshuaj tiv thaiv polymerization (cov yeeb yaj kiab qhuav hauv cov cheeb tsam no yuav raug khaws cia raws li kev tiv thaiv etch hauv kev txhim kho tom ntej thiab cov kauj ruam tooj liab etching), hloov cov duab hluav taws xob los ntawm cov yeeb yaj kiab mus rau cov yeeb yaj kiab qhuav photoresist ntawm board nto. Tom qab tshem tawm cov yeeb yaj kiab tiv thaiv los ntawm cov yeeb yaj kiab, cov chaw tsis pom kev yog thawj zaug de- ntub dej nrog cov tshuaj sodium carbonate. Tom qab ntawd, cov ntawv ci tooj liab raug muab tshem tawm nrog kev sib xyaw ntawm hydrochloric acid thiab hydrogen peroxide los tsim lub voj voog. Thaum kawg, cov yeeb yaj kiab qhuav photoresist raug tshem tawm nrog cov tshuaj sodium hydroxide. Rau cov txheej txheej hauv Circuit Court boards nrog rau los yog ntau txheej, ib qho tsis siv neeg qhov chaw punch yog siv los xuas nrig ntaus qhov rau interlayer circuit alignment.
