Thermal Expansion: Hlau substrates zoo txo cov thermal expansion thiab contraction ntawm cov khoom, txhim kho cov cuab yeej durability thiab kev ntseeg siab.
Thaum tshav kub kub Dissipation: Hlau substrates pab daws cov teeb meem kub dissipation nyob rau hauv siab - ntom, siab - fais fab Circuit Court boards.
Dimensional Stability: Hlau substrates muaj ntau dua qhov ruaj khov dua li cov ntaub ntawv insulating.
Kev siv dav: Aluminium substrates tau dav siv hauv cov khoom siv suab, khoos phis tawj, tsheb, thiab teeb pom kev zoo. Copper substrates yog haum rau siab - zaus circuits thiab nyob rau hauv cov cheeb tsam uas muaj qhov kub thiab txias hloov.
